What are powder metallurgy processes

Powder Metallurgy
1 Hot press(HP)
Hot pressing is one of the powder metallurgy processes. The powders will be hot pressed and sintered to uniformly dense. The applied pressure is divided into static and dynamic, with uniaxial or biaxial pressure direct contact pressure, sintered by heating various powder together, and forming method for bulk materials. The bulk density is related to pressure, time, temperature, particle size and so on.

Advantage
Uniform composition
Suitable for high melting material
Avoid the air hole or sand hole
Suitable for hard or brittle production
High repeatability

Production
Hard disk target
Magnetic recording layer
Interlayer layer
Under layer
Optical disk target
Solar cell target

2 Vacuum Induction Melting(VIM)
Vacuum induction melting is a process which metal is melted by electromagnetic induction in a vacuum. Molten metal is produced by producing eddy currents in the metal. Casting is usually to pour liquid metal material into a mold, to be cooled solidification, forming a ingot.

Advantage
Low costs
High impurity、Low gas content
High production efficiency
High recycling ability

Production
Hard disk target
Magnetic recording layer
Soft under layer
Optical disk target
Reflective layer
Solar cell target

Stanford Advanced Materials specializes in the production of high-quality sputtering target, ceramic target, metal target. The product through a variety of methods (magnetron sputtering, vacuum plating etc.) in various application of vacuum coating: scientific research, aerospace, automotive, microelectronics, integrated circuit industry, light source, optical, decorative, flat panel display industry, the information storage industry, data storage and so on.

The purity of the target has a great influence on the properties of the sputtered jet film. The higher the purity of the target is, the better the performance of the sputtered jet film is. For example, the higher the purity of A1 target is, the better the corrosion resistance and electrical and optical properties of the sputtered A1 film is. However, in practical applications, the requirements for purity of different target materials are different. For example, the general target of industrial purity is not demanding, and semiconductor, display and other fields have very strict requirements on the purity of the target; target purity of magnetic thin films is more than 99.9%, the purity of In2O3 and SnO2 in the ITO target is not less than 99.99%.

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